At least seven Apple suppliers have reportedly kicked off circuit board-related shipments for upcoming Apple products, and this notably includes third-generation AirPods, which are expected to be released later this year.
“Suppliers including Semco, LG Innotek, Kinsus, Unimicron, Nan Ya, Zhen Ding and AT&S have all kicked off their BT substrate shipments for Apple’s next-generation products including the Apple Watch, AirPods and iPhone, which all adopt SiP modules,” a paywalled DigiTimes report claimed today, citing industry sources.
Bloomberg‘s Mark Gurman and Debby Wu previously reported that the third-generation AirPods will be released later in 2021 with a similar design as the AirPods Pro, including shorter stems. This would mark the first update to the standard AirPods since March 2019, when the second-generation pair launched with the H1 chip for hands-free “Hey Siri” functionality and up to 50 percent more talk time than the original AirPods.
The second-generation AirPods are priced at $159 with a wired charging case and at $199 with a wireless charging case, and the third-generation AirPods would maintain a lower price than the AirPods Pro, which cost $249 regularly but are frequently on sale. It’s likely that the third-generation AirPods will lack some higher-end features like active noise cancellation to maintain this lower price point.
As for the AirPods Pro, a second-generation pair with fitness tracking are rumored to launch next year, and they may have a more compact design similar to Apple’s new Beats Studio Buds released earlier this month.
This article, “New AirPods Expected Later This Year as Suppliers Begin Component Shipments” first appeared on MacRumors.com
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